| 摘要 |
<p>PURPOSE:To enable to prevent the strain to apply on lead pins by a method wherein the thickness of the reinforcing member is made smaller than that of the gap between the lead attaching surface on the wiring printed substrate and the back surface of the package and a bonding agent is made to interpose inbetween the gap between the reinforcing member and the lead attaching surface on the wiring printed substrate. CONSTITUTION:A heat sink 12 is adhered on the upper surface of a ceramic substrate 11 formed into an almost rectangular form through a bonding agent 16 and an FP type package 10 is formed. A reinforcing member 13 formed smaller its thickness than the thickness of the gap A between the back surface of the FP type package 10 and a lead attaching surface 14 on a wiring printed substrate 3 is arranged on the back surface of the substrate 11 and a bonding agent 15 is made to interpose inbetween the gap (a) between the reinforcing member 13 and the lead attaching surface 14 on the wiring printed substrate 3. A flat lead package type electronic parts is constituted in such a way. The FP type package 10 is mounted as follows: firstly, the bonding agent 15 is held being filled in advance on either side of the back surface of the reinforcing member 13 or the FP type package attaching surface on the wiring printed substrate 13 and the FP type package 10 is positioned on the wiring printed substrate 3. Then, the FP type package 10 is fixed by performing a soldering, for example, before the bonding agent 15 is cured.</p> |
