发明名称 JOINING METHOD OF COMPOSITE LEAD TAPE
摘要 <p>PURPOSE:To join easily lead foil to each other and to join securely composite lead tapes by superposing the laminated tapes each consisting of lead oil and plastic films via the solder interposed therebetween and subjecting the solder to compression bonding with heating. CONSTITUTION:Laminated tapes 5, 5 formed by adhering respectively plastic films 2, 2' to both surfaces of lead foil 1, 1' are superposed via the solder 3 interposed therebetween and are subjected to compression-bonding with heating under about 0.1-10.0kg/cm<2> compression-bonding force at the temp. below the solidus line of the foil 1, 1 and above the m.p. of the plastics 2, 2' and above the liquidus line temp. of the solder 3. The foil 1, 1' are thus connected to each other by the solder 3 and the electrically satisfactorily joined part having high strength and excellent water shielding property is obtd. without increasing the thickness. Non-oxidizing solder is preferably used as the solder 3 in order to prevent generation of the pinhole, void, etc. in the solder joined part.</p>
申请公布号 JPS60127071(A) 申请公布日期 1985.07.06
申请号 JP19830207070 申请日期 1983.11.04
申请人 FURUKAWA DENKI KOGYO KK 发明人 UEMATSU TADAYUKI
分类号 B23K1/18;B23K1/19;B29C65/02 主分类号 B23K1/18
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