发明名称 LEAD FRAME
摘要 PURPOSE:To bond leads and a sealing resin excellently by selectively forming a film consisting of a metallic oxide to the surface of a section being in contact with the sealing resin for an inner lead section in a lead frame. CONSTITUTION:Lead section 1 are sealed, a metal easy to be oxidized more than a lead-frame structure material such as nickel is plated and formed previously to sections except bonding sections in surfaces being in contact with a resin, and the lead frame is exposed into an oxidizing atmosphere at a high temperature to oxidize the surfaces of nickel layers, and nickel oxide films 7 are formed. When the lead frame is sealed with the resin, moisture and impurities are difficult to intrude because the interfaces among the oxide films 7 in nickel and the sealing resin 2 as the intruding courses of moisture and impurities have excellent adhesive properties.
申请公布号 JPS6060742(A) 申请公布日期 1985.04.08
申请号 JP19830169652 申请日期 1983.09.14
申请人 MATSUSHITA DENSHI KOGYO KK 发明人 OKAMOTO TOMIO
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址