SEMICONDUCTOR MEMORY DEVICE AND PROCESS FOR FABRICATING THE DEVICE

摘要

A one transistor, one capacitance type dynamic MOS.RAM is provided with a buried storage capacitor and a planar transfer electrode. The MOS.RAM is, therefore, characterized by a small size of the memory cells and a simple production process. One process feature of the present invention is that a quick diffusion through polycrystalline silicon is employed for forming a vertical connection between the buried storage capacitor and the source or drain of the MOS transistor.