Process for metallising a plastic surface

摘要

A method, in particular, for metallising plastic films, is specified which is especially suitable for producing thin-film circuits which can be highly stressed thermally. The essence of the process is to metallise the circuit carrier film after mechanical and chemical pretreatment either electrolessly and by electrodeposition without using an adhesive layer or to laminate it with a metal foil, also mechanically pretreated, using an adhesive suitable for the circuit carrier material.