发明名称 DIAMOND CUTTING TOOL
摘要 PURPOSE:To prevent chips from being taken-up onto a cutting tool and obtain a mirror surface having a high accuracy by prescribing the shape of a diamond cutting tool and compulsorily generating warp during cutting for a soft material. CONSTITUTION:A diamond cutting tool tip 1 revolves on a certain radius of revolution and its locus is shown by the circle 14, and the tip revolves in the direction of arrow 12. An article 11 to be worked shifts in the direction of arrow 13. Warp is formed during cutting by providing certain angles for the tip 1 with respect to the direction of advance of the cutting tool, and said warps are laminated. The above-described angles theta1 and theta2 are in the relation theta1+theta2=alpha-90. Cutting is carried-out by cutting edge ridges 8 and 3.
申请公布号 JPS6025607(A) 申请公布日期 1985.02.08
申请号 JP19830135336 申请日期 1983.07.25
申请人 NEC HOME ELECTRONICS KK 发明人 YOSHII SEIICHI
分类号 B23B27/20;(IPC1-7):B23B27/20 主分类号 B23B27/20
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