| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device and method which efficiently can provide chips with stable quality.SOLUTION: A laser processing device 1 is equipped with: a laser light source 22; a spatial light modulator 28 that modulates laser light L outputted from the laser light source 22; a condensing lens 38 that condenses the laser light L modulated by the spatial light modulator 28 into a wafer W; a wafer moving part 11 that moves relatively the wafer W to the laser light L; a corrector ring 40 that corrects aberration of the laser light by an amount corresponding to a thickness of the wafer ranging from a laser light incident face to a predetermined reference depth of the wafer W; and a control part 50 that controls the spatial light modulator 28 so that the aberration of the laser light L is corrected by an amount corresponding to a thickness of the wafer ranging from the reference depth to a position at which the laser light is condensed of the wafer W.SELECTED DRAWING: Figure 1 |
