| 摘要 |
PURPOSE:To simplify the process of removing sticking matters and improve cleaning effect by blowing air to the surface of a substrate by using air blowing nozzles which move radially over the substrate at specific distance to the substrate surface. CONSTITUTION:While both-surface sputtering is carried out in a room A by rotating the substrate 4, film thickness is monitored, and the substrate is moved to a room B in the middle; and high-speed clean and dry air of room temperature is blown to the rotating substrate 4 while nozzles 6 and 7 are moved radially over the substrate 4. The nozzles 6 and 7 are arranged at 2-3 distance from the surface of the substrate 4 and held at the access part 12a of an access device 12 while the distance is maintained; and they are put in radial reciprocation at a long period >=5 times as long as the rotation period of the substrate 4 to blow away impurities on the film. Thus, the process is simplified to improve the cleaning effect. |
