发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the cutting caused by the short circuit and friction between a wire and a pellet and the wire fall by a sealed resin by a method wherein a supporting body is formed in the peripheral edge of a pellet of the possibility that bonding wires contact besides pellet electrodes. CONSTITUTION:The supporting body 5 is screen-printed to the peripheral edge of the pellet 1 in wafer state. By considering the cutting spaces on timing, supporting body forming regions are printed at all the parts of the possibility that the wires 2 contact at least the surface end of the pellet 1. Besides, at the top of the supporting body 5, the recesses 6 for supporting these wires are provided at positions for the extension of these wires 2. The recess 6 after printing and hardening is formed to a height whereby the wire can be sufficiently held and does not contact the surface end of the pellet 1.
申请公布号 JPS59175149(A) 申请公布日期 1984.10.03
申请号 JP19830050054 申请日期 1983.03.24
申请人 MATSUSHITA DENSHI KOGYO KK 发明人 MITSUI SHINJI;OKAMOTO TOMIO
分类号 H01L21/60 主分类号 H01L21/60
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