| 摘要 |
PURPOSE:To remove malfunction, to eliminate the need for the coincidence of various characteristics of a circuit and manufacturing processes for a chip and to improve mounting density by oppositely arranging a photodetecting element and a signal processing element through a substrate. CONSTITUTION:Regarding a first die bonding method among a ceramic substrate 20 and both a photodetecting element 21 and a signal processing element 22, an Au plated surface formed to an indent section 20A for a back and the exposed surface of an Si foundation on the back of the photodetecting element 21 are melted and joined by using a eutectic temperature in a method such as a eutectic method. The signal processing element 22 and a back indent section 20B are also melted and joined in the same manner as the photodetecting element 21. Pads 23A-23D for extracting electrodes are formed at each end section 21A, 21B and end section 22A, 22B of the photodetecting element 21 and the signal processing element 22. The connections of first and second conductive patterns 24A-24D and third conductive patterns 25A, 25B are each formed. |
