RECOGNIZING DEVICE WITH IMAGE PICKUP OPTICAL SYSTEM

摘要

PURPOSE:To improve the locating precision of the titled recognizing device by a method wherein any hot air convection on the vertical path of an optical imaging system is restricted by an air convection preventive plate provided on the image pickup optical system to reduce the waving of input images. CONSTITUTION:A substrate 14 and semiconductor chips 15 are placed on a substrate placing bed 13 while an image pickup optical system 11 is mounted around 50mm. above the bed 13. When a recognizing device locates a position, an air convection preventive plate 31 is projected on the optical path of the image pickup optical system 11 by means of an air convection preventive plate in and out device 32. The substrate placing bed 13 is heated up to 250-300 deg.C to heat the semiconductor chips 15. Next said preventive plate 31 is retracted by said in and out device 32. The wiring between a located semiconductor chips 15 and a package is performed by operating bonding head 12 of a wire bonder. The retracted preventive plate 31 is forcibly cooled down while it is retracted by a cooling device 33 not to produce any hot air flow by the temperature thereof when it is projected again to cover the surface of another semiconductor chip 15.