| 摘要 |
Method of corrosive attack on copper. The copper 13 is exposed to a gaseous or liquid oxidising agent in the presence of a catalyst which activates the reaction between the copper 13 and the oxidising agent. In some forms of embodiment the catalyst is carried by a medium which is also used to receive the oxidised copper compound produced by the reaction and in a preferred form of embodiment, the medium comprises a laminated structure consisting of a first layer 11 which contains a catalyst and a second layer 12 which receives the oxidised copper compound. The etching is mainly anisotropic, and this alleviates the problem of attack under the copper. Application to the production of printed circuit boards. <IMAGE>
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