发明名称 VAPOR DEPOSITION DEVICE BY RESISTANCE HEATING
摘要 PURPOSE:To make the distance between the work, and a film thickness gauge and a heater for vapor deposition constant and to improve the accuracy in the control of a film thickness in a vapor deposition device by resistance heating, by fixing the heater for vapor deposition while applying forcibly a deformation between opposed electrodes having inclination. CONSTITUTION:The work 2 is mounted to a holder 1 supported by stanchions 3, and electricity is conducted to a vapor deposition metal 6 mounted on electrodes 4, 4 by means of a heater 5 for vapor deposition in the lower part to evaporate the metal and to deposit the same on the bottom surface of the work 2. The heater 5 is screwed 7 to the inclined electrodes 4 and therefore the heater is deformed from the beginning and even if the heater is thermally expanded by the conduction of electricity, the deformation progresses in one direction only, and the distance between the vapor deposion source and the work 2 and a film thickness gauge 8 is kept constant without producing any difference, whereby the thickness of the film deposited on the work 2 by evaporation is controlled with good accuracy.
申请公布号 JPS5967367(A) 申请公布日期 1984.04.17
申请号 JP19820177743 申请日期 1982.10.07
申请人 MITSUBISHI DENKI KK 发明人 NODA SHIYOUICHI
分类号 C23C14/26 主分类号 C23C14/26
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