FORFARANDE FOR DRIFT AV ETT FOR STROMLOS AVSETTNING AVSETT KOPPAR- ELLER KOPPARLEGERINGSBAD

摘要

1529151 Maintaining the concentration in an electroless Cu plating bath KOLLMORGEN TECHNOLOGY CORP 5 April 1977 [8 April 1976 28 May 1976] 14464/77 Heading C7F Maintaining the copper ion concentration in an electroless plating bath comprising an aqueous alkaline medium, a copper ion complexing agent and a copper ion reducing agent by either interrupting the copper deposition or withdrawing a portion of the plating bath and contacting the bath or portion thereof with a copper containing substance. The salt-forming anion content is substantially less than one equivalent weight per equivalent weight of copper therein and the copper contents of said substance is capable of forming a copper complex with said copper ion complexing agent to replenish the copper content of the bath or portion thereof and the copper deposition in the enriched bath is either continued or the enriched portion returned to the bath.