METHOD FOR SUPPRESSING COPPER PLATING,申请号JP19820062309-传众专利搜索

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发明名称	METHOD FOR SUPPRESSING COPPER PLATING
摘要
申请公布号	JPS58181877(A)	申请公布日期	1983.10.24
申请号	JP19820062309	申请日期	1982.04.16
申请人	MITSUBISHI JUKOGYO KK	发明人	YAMADA TETSUZOU
分类号	C23F15/00	主分类号	C23F15/00
代理机构		代理人
主权项
地址

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