发明名称 Thermoplastic moulding composition
摘要 The invention relates to a thermoplastic moulding composition which contains a polycarbonate resin of high molecular weight and a hydrogenated AIA block copolymer, in which A is derived from an alkenylaromatic compound and I is derived from isoprene.
申请公布号 DE3300855(A1) 申请公布日期 1983.08.11
申请号 DE19833300855 申请日期 1983.01.13
申请人 GENERAL ELECTRIC CO. 发明人 YUAN LIU,PING
分类号 C08L53/00;C08L23/00;C08L51/00;C08L51/02;C08L69/00;C08L77/00;C08L101/00;(IPC1-7):C08L69/00;C08L53/02 主分类号 C08L53/00
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