发明名称 RESIN SEALING DEVICE
摘要 PURPOSE:To obtain high molding yield of the resin sealing device without damaging productivity by a method wherein independent metal molds having cavities of a small number are connected mutually to constitute the metal mold having the cavities of a large number. CONSTITUTION:Runners 3A and the cavities 5A corresponding to a chamber 2A are independent of runners 3B and the cavities 5B corresponding to a chamber 2B, and resin thrown in the chamber 2A and resin thrown in the chamber 2B are not mixed mutually. At this case, because the number of the cavities corresponding to one chamber 2A or 2B is small, the quantities of resin necessitated respectively for the respective chambers 2A, 2B are also little, and the runners 3A, 3B can be also shortened. Accordingly the range of selection of melting viscosity, melting time, etc., of resin to be used is broad, non pour-in and rolling up of an air bubble, etc., can be prevented, and yield of molding can be enhanced.
申请公布号 JPS58119645(A) 申请公布日期 1983.07.16
申请号 JP19820001525 申请日期 1982.01.07
申请人 MITSUBISHI DENKI KK 发明人 TAKEHARA KATSUNAO
分类号 B29C45/26;B29C43/00;B29C45/02;H01L21/56 主分类号 B29C45/26
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