| 摘要 |
PURPOSE:To form a fine phosphor screen by impregnating a positive type resist in the phosphor formed on an anode electrode and by employing a photolithography method exposing from the rear of a substrate using the anode electrode as a photo mask so as to remove the phosphor protruded from the anode electrode and to arrange the shape of the phosphor screen. CONSTITUTION:A positive type resist is spread on a substrate electrodeposited with a phosphor layer 3 by means of a spinner method, and pre-baking is performed for a predetermined time. As a result, the resist impregnates into the phosphor layer so that the phosphor layer 3 is stuck to the substrate by the resist. Next, exposure is performed from the rear of the substrate, and subsequently development, rinsing, and drying are performed, thereby the phosphor layer protruded from the periphery of the Al thin film 2 is dissolved and removed together with the resist, and only the phosphor 3 with the same shape as that of the Al thin film 2 is left behind. Furthermore, sintering is performed at 580 deg.C for some 30min to remove the unnecessary resist, thus an excellent phosphor screen with no protrusion of the phosphor can be formed. |
