发明名称 FILM THICKNESS MONITORING DEVICE IN THIN FILM FORMING DEVICE
摘要 PURPOSE:To make it possible to use effectively along the entire surface of a material to be machined, by scanning film thickness monitoring light in the moving direction of the material to be machined wherein a thin film is formed. CONSTITUTION:Long film 4 to be machined is moved between reels 5 and 6 above vaporizing source 2 in a vacuum processing chamber 1. A vaporized material is evaporated on the film, and the thin film is formed on the surface. Meanwhile, luminous flux 11 from a light projector 9 reaches a light receiver 10 through a reflecting mirror 8. In this case, the transmitted light through the film can be received, or the light reflected by the film surface can be received as illustrated by alternate long and two short dashes line. The thickness of evaporated film is thin at the feeding side of the film and thick at the winding side. Therefore, when the reflecting mirror 8 is moved to right and left, the distribution of the thicknesses can be measured.
申请公布号 JPS5850409(A) 申请公布日期 1983.03.24
申请号 JP19810147924 申请日期 1981.09.21
申请人 NIPPON SHINKU GIJUTSU KK 发明人 TOKU AKIHIKO
分类号 C23C14/54;G01B11/06 主分类号 C23C14/54
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