| 摘要 |
PURPOSE:To effectively bond a semiconductor pellet in a foil supplying device by providing at least one or more vacuum suction holes outside a center of the surface of a collet. CONSTITUTION:A lower cutting edge 13 is formed in a recess shape on its upper surface 13a, and a collet 14 is formed in a projected shape on the surface 14a to be press-bonded so that the curvature of the surface 13a is equal to or larger than that of the surface 14a. a plurality of vacuum suction holes 14b are formed outside the center of the surface 14a. A foil strip 15 led out from a bobbin 10 is held by an upper edge 11 and a retainer plate 12, a foil 15 is cut in the prescribed length by the edge 13, is then attracted by the collet 14, the attracted foil 15 is conveyed to a metal substrate 16, and is press-bonded to the mounting position of the pellet of the substrate 16. With this structure, the deformed part of the foil in case of attracting the foil is formed outside the center. Accordingly, gas of the deformed part in case of press-bonding the foil can be readily exhausted. |
