| 摘要 |
PURPOSE:To prevent the defect generating due to the fragility of resist as well as to accurately form the microscopic pattern uniformly for the titled semiconductor device by a method wherein an organic film, having cyclized polyisoprene rubber mainly composed of an overcoating agent, is used. CONSTITUTION:A photosensitive resist is applied on one main surface of a semiconductor substrate 1, and an organic film 2 is formed. Then, a non-photosensitive resist, which is mainly composed of cyclized polyisoprene rubber containing no optical crosslinking agent, is applied on the film 2, and an organic film 3 is formed. Then, the substrate 1 thus processed is exposed using a prescribed mask 4 and an aliner. Then, after the film 3 has been removed entirely, the exposed part on the under layer or one of the non-exposed part is removed by developing, and an aperture section is formed. Accordingly, a described pattern is formed in the substrate 1 by performing and etching on the aperture section 5. Accordingly, a microscopic patterning can be performed in a completely stable state.
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