| 摘要 |
<p>PURPOSE:To facilitate stability of property suppressing instabilizing phenomenon of electrical property due to forming of a parasitic channel on semiconductor surface caused by electrification of resin, by setting with an electrode plate a potential of a resin part on the surface of an active region in semiconductor. CONSTITUTION:When externally sealing with organic compound resin 5, an external lead 4 connected to a bonding wire 3 and a metal plate 2 mounted on a semiconductor element 1, an electrode 6 consisting of a metal film or a metal plate is provided facing the semiconductor element on the surface or the inside of the resin 5 thereby making possible the application of a preset voltage from outside.</p> |
