Process of treating anodic oxide film, printed wiring board and process of making the same.

摘要

A process of treating an anodic oxide film wherein a base material of a valve metal is anodized to form the anodic oxide film thereon, which is then impregnated with a polymerizable organic metal compound and thereafter subjected to polymerization of the compound, whereby the mircopores of the anodic oxide film are filled and sealed with the polymerized organometallic compound. According to this process, there is provided a base material having an anodic oxide film impregnated with polymerized organometallic compound which is excellent in heat resistance, heat radiance, and electrical insulation, and hence the base material is useful for the printed wiring board, electrically- insulative heat sink, heat-resistant insulated wire and the like.