摘要 |
PURPOSE:To eliminate the displacement of the end of an inner lead to effectively detect the position of an automatic bonder by providing a projection or a bent part on the outer frame for connecting the lead. CONSTITUTION:A solder-shaped projection 4, a small projection or a bent part is formed by pressing at the outer supporting frame 3 of a lead frame. In this manner, even if a strain takes place in a frame blank, or even if a strain due to pressing is produced, the lead frame becomes sufficiently rigid by the projection or bent part, thereby preventing the displacement of the end of the inner lead due to the deformation. |