发明名称 LEAD FRAME
摘要 PURPOSE:To eliminate the displacement of the end of an inner lead to effectively detect the position of an automatic bonder by providing a projection or a bent part on the outer frame for connecting the lead. CONSTITUTION:A solder-shaped projection 4, a small projection or a bent part is formed by pressing at the outer supporting frame 3 of a lead frame. In this manner, even if a strain takes place in a frame blank, or even if a strain due to pressing is produced, the lead frame becomes sufficiently rigid by the projection or bent part, thereby preventing the displacement of the end of the inner lead due to the deformation.
申请公布号 JPS57114262(A) 申请公布日期 1982.07.16
申请号 JP19810000585 申请日期 1981.01.06
申请人 NIPPON DENKI KK 发明人 HORIUCHI KOUJI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址