| 摘要 |
PURPOSE:To bestow corrosion resistance and affinity to solder to a semiconductor device by a method wherein melted solder is adhered on the surface of the metal part exposed to the outside part of outside lead wire, shell, etc. CONSTITUTION:At the ceramic package type semiconductor device, by adhering melted solder instead of tir plating on the surface of the metal of outside lead wire, shell, etc., exposed outside and having the nickel plating ground, corrosion resistance and conformability to solder are bestowed to the surface of the metal mentioned above. Accordingly even when the metal parts of the device is dipped in the normal melted solder having larger thermal shock than jet soldering to make solder to be adhered, the parts can endure satisfactorily, and damage of air-tight sealing property of the semiconductor device and bad influence to element are not generated, and even on a device being inserted with galss for transmission of ultraviolet rays like a programmable ROM, solder can be adhered without generating splitting of glass or cracking. |
