| 摘要 |
PURPOSE:To enable a wire to be mounted at a low height by stopping the continuous extrusion of the wire at the position in which a capillary tool is moved at the predetermined distance from the first bonding point, moving it to the second bonding point and soldering the wire. CONSTITUTION:A clamper 8 and a clamp 9 are opened, a capillary tool 2 is lowered to the first bonding point, and a wire 3 is soldered to a pad 4a. Then, the tool 2 is moved at a predetermined distance, is then lowered at a predetermined height, the clamp 9 is then closed, the tool 2 is then lowered to the second bonding point in the state that the wire is not led, and the wire is soldered to a pad 1a. Thereafter, the wire 3 is cut by a gas burner, the clamp 9 is opened, and the tool 2 is upwardly pulled up. Thus, the wire can be mounted at an extremely low height between the pads. |
