| 摘要 |
PURPOSE:To remove burr of a resin-sealed semiconductor device without damaging the semiconductor by etching a metallic film preformed on an externally led conductor after sealing resin therewith. CONSTITUTION:A lead frame 5 plated at 4 with the portion externally led from a sealing resin 2 at the lead wire 1a is prepared. The plating thickness 4 may be preferably higher than 5. After assembling as prescribed, it is sealed with resin 2, and the plated film 4 is etched. Then, a gap 6 is produced between the lead wire 1a and the burr 3. When compressed air is blown to the burr 3, the burr 3 can be easily removed. |
