| 摘要 |
PURPOSE:To make dust removal process unnecessary and operate excess resin removal continuously by the method wherein, while external leads connected to an electronic component are pulled out, resin sealing is operated, and excess resin film exuded at this time is removed by the deformation of elastic bodies. CONSTITUTION:A plurality of leads 1 projecting from resin-sealed type electronic component 4 are attached with burrs at the places where they pass through the component. These burrs are removed by using the following mechanisms. That is, place upper roll 17 consisting of upper roll 15, whose outer circumferential part is fitted with elastic body 16 made of urethane rubber via rubber lining, and lower roll 18 having solid character, in such a manner that the upper and lower rolls face each other. This is made as roll mechanism I. Roll mechanism II is formed, which is of the same shape as roll mechanism I, but its upper roll 19 is a solid body and its lower roll 20 consists of elastic body 21. These mechanisms are arranged in series. Burr 11 is passed between the rolls of mechanism I and then between the rolls of mechanism II, and burr 11 is removed by the friction produced by the deformation of elastic bodies 16 and 21. |
