| 摘要 |
Surface-processed copper foil and a circuit board are provided to offer excellent adhesion of an insulating substrate and low contact resistance of a metal grain and conductive paste. A copper foil circuit is installed at an outside of an insulating substrate. The copper foil circuit on a laminated substrate connected to a through-hole(2) which is formed on the insulating substrates(1,11,12,15,16), is comprised of surface-processed copper foil. One side at lest of the copper foil(4,5,13,14,17,18) is processed to become 30% or more of the surface of copper foil.
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