| 摘要 |
<p>PURPOSE:To stabilize the operation of a semiconductor device and prevent the oscillation thereof by connecting directly between the same type electrode bonding pads in an adjacent semiconductor elements to commonly connect a plurality of chips so as to obtain large output power. CONSTITUTION:The gate electrode bonding pad 5 of a chip 41, the gate electrode bonding pad 5 of a chip 42, the drain electrode bonding pad 6 of the chip 41 and the drain electrode bonding pad 6 of the chip 42 are connected at minimum distance, that is, linearly connected with bonding wires 8. Since the operating states of the respective chips are equalized as a result, no state exchange occurs among the chips to stabilize the operation of the semiconductor device and prevent the oscillation of the device.</p> |
