| 摘要 |
A sub-assembly unit for a circuit assembly comprises a planar substrate 10, with at least one component or module 13 supported on at least one major surface 11 of the substrate, together with possibly a lead retaining member 16 the lead 14 of the modules being shaped to form the contact surface of a plug, or socket, including, at least part of the substrate and/or the lead retaining member, if provided, and to co-operate with an associated socket, or plug, respectively, to complete the circuit assembly, the terminals of the component or module within the circuit assembly and of the circuit assembly, being provided by the contact parts 21 of the associated socket, or plug. <IMAGE>
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