| 摘要 |
PURPOSE:To solder a small piece of Al covering on the heat sink or the lead wire connected to the upper surface of an FET-fitting header substrate through inclination and to connect the wire from the source electrode of said FET with the upper surface of said small piece easily and securely. CONSTITUTION:An FET 3 is fitted on the heat sink 2 at a portion of a Cu header 1, and a small piece 8 made by sticking an Al plate or foil to a heat sink 7 is provided. Next, the source electrode of said FET 3 and said small piece 8 are interconnected by means of Al wire 9. Thus, the junction of small Al piece and Al wire 9 with each other can be facilitated and a source electrode can be connected securely with a header. Further, a small piece 11 of Al covering may be attached to an end of a T-shaped lead wire 6.
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