| 摘要 |
A circuit module is mounted on a flexible substrate, forming what is usually referred to as a micropack. This substrate has soldered conducting paths that are provided with solder spots at the sites where they shall be bonded with the conducting paths of a thin-film hybrid circuit. the micropack is inserted onto the hybrid circuit with a pair of vacuum forceps or tweezers, and adjusted and pressed into the conducting paths of the hybrid circuit under the action of the pins of a pressure plate or clamp. At the same time, the conducting paths of the micropack are bonded with the conducting paths of the hybrid circuit through infrared irradiation.
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