| 摘要 |
A multiple contact test probe assembly for testing miniature electronic circuit devices includes a non-conductive support having a plurality of spaced slots extending therethrough, all of the slots being substantially parallel and lying in a common plane. The assembly is provided with a plurality of electrically conductive contact elements, each element dimensioned to press fit within at least one of the slots and having a bend between the ends of each element to restrict sliding through the corresponding slot. At least one end of each contact element is adapted to sequentially engage a miniature electronic circuit for testing purposes, each contact element having sufficient tensile strength to withstand sequential testing of the circuit devices.
|
