| 摘要 |
<p>of the Disclosure Making film adhesive from a thermosettable resin composition presents difficulties if the composition is not soluble in a volatile solvent, or not readily fusible without gelling prematurely, or undergoes undesirable advancement on being subjected to extrusion procedures. Such compositions in the form of solid particles can be made into film adhesive by coating a carrier with a readily-curable thermosettable resin composition, which is preferably tacky, applying the solid ¢articles to the coating, and then curling the coating under conditions such that the particles of thermosettable resin composition remain curable.</p> |
