VERFAHREN ZUM HERSTELLEN MEHRSCHICHTIGER KERAMISCHER SUBSTRATE

摘要

A method of making a multi-layer ceramic substrate for an integrated circuit device package having internal circuitry by forming a plurality of porous ceramic bisque sheets, impregnating the pores of the bisque sheets with an organic binder material, forming openings through the impregnated bisque sheets, filling the openings with conductive material and imprinting conductive circuitry patterns on the surface of the impregnated bisque sheets of a conductive material, assembling the plurality of apertured printed impregnated bisque sheets into a laminated unit, and sintering the laminated unit to form a unitary laminated structure having an interconnected internal circuitry system.