发明名称 MEMS packaging structure and methods
摘要 A MEMS article is made by forming a MEMS device on a first substrate, providing a second substrate, depositing a layer of etchable dielectric material, forming at least one lateral post-bond release-etch port by a damascene process using a sacrificial material, and bonding the two substrates together.
申请公布号 US7288464(B2) 申请公布日期 2007.10.30
申请号 US20050104704 申请日期 2005.04.11
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 HALUZAK CHARLES C.;POLLARD JEFFREY R.
分类号 H01L21/30 主分类号 H01L21/30
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