| 摘要 |
<p>PURPOSE:To eliminate the cap sealing step while enhancing the junction reliability in a junction part. CONSTITUTION:In the title packaging method wherein a substrate 1 whereon conductive patterns are formed and a semiconductor device 2 are junctioned with each other through the intermediary of bumps 4, firstly, the semiconductor 2 is bond-fixed to the bottom surface of a cap 10. Later, the electrode pads 3 formed on the surface of the semiconductor 2 and the bumps 4 on the substrate conductor or the bumps 4 formed on the surface of the semiconductor device 2 and the substrate conductor are aligned to be brought into contact with one another for pressurization step so that the opening end of the cap 10 may be bond-fixed to a substrate 1 leaving the contact pressurized state intact. Through these procedures, the packaging step of the semiconductor device 2 and the airtight sealing step can be simultaneously discharged.</p> |
