| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polishing apparatus for a semiconductor device, capable of reducing erosion at the time of polishing. SOLUTION: This polishing apparatus for polishing a wafer 11 comprises, a carrier 10 which is composed of a porous substance capable of permeating a liquid body to be supplied to a back face and has a backing plate 12 for flatly retaining the wafer 11, a liquid body supply route 14 for supplying a liquid body 16 of which a temperature is adjusted so as to cool the back face of the wafer to the face of the backing plate 12 through a rotary shaft 13 of the carrier 10, and a liquid body discharge route 15 for discharging a liquid body 17 which permeates the backing plate 12 and is supplied to the back face of the wafer to the outside of the carrier. |
