| 摘要 |
PROBLEM TO BE SOLVED: To reduce surface roughness of a diamond sintered compact to enable processing of a cutting target material highly precisely.SOLUTION: A diamond sintered compact ball end mill 1 comprises a blade part 3 at a tip end of a tool body 2 and whose surface is formed into a hemispherical surface. The blade part 3 is composed of protrusions formed of diamond particles C and recessions formed of a binder Co. Further, the blade part 3 is formed into the hemispherical shape by electrical discharge machining, in which the protrusions and recessions on the surface are polished to set the surface roughness of 2 μm before the polishing to be reduced to the maximum of 1 μm or less and an average of 0.18 μm or less after the polishing. The polishing can remove diamond whose heat affected layer is deteriorated, oxides, and Cu, Zn and the like of wire components melted during the electrical discharge machining, which adhere to the surface of the protrusions, and also the diamond particles that largely protrude. Still further, a clearance angle of the hemispherical surface of the blade part 3 is 0°, so that the cutting processing can be also performed by using the protrusions on a flank of the hemispherical surface.SELECTED DRAWING: Figure 1 |
