发明名称 |
Aqueous photosensitive resin compsition and print obtained by using the same |
摘要 |
An aqueous-based photosensitive resin for the production of printed circuit boards comprises (a) a carboxyl group-containing resin, (b) an amino compound; (c) a photo-curable unsaturated compound and (d) a photo-polymerization initiator. Component (a) may be an acrylic resin or an acid anhydride copolymer, e.g. a styrene-maleic anhydride copolymer, wherein the anhydride groups have been ring-opened with an alcohol or a primary or secondary amino which may have a polymerizable unsaturated bond. Component (c) may be replaced by an amino compound and/or a carboxyl group-containing resin which has a photopolymerizable unsaturated bond. |
申请公布号 |
ZA9204998(B) |
申请公布日期 |
1994.09.26 |
申请号 |
ZA19920004998 |
申请日期 |
1992.07.06 |
申请人 |
W. R. GRACE & CO-CONN, US |
发明人 |
HIROSHI SAMUKAWA |
分类号 |
C08F2/48;C08F290/00;C08F291/00;C08F299/00;C08J3/03;C08L101/00;C08L101/08;G03F7/027;G03F7/033;G03F7/038;H01L21/027;H05K3/06 |
主分类号 |
C08F2/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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