| 摘要 |
A semiconductor chip (14) is flip-chip mounted to conductors on a substrate by depositing layers of chromium (24), copper (26), and gold (28) on the chip (or the substrate), forming solder mounds (30) on said layers, and reflowing the mounds before or during the flip-chip mounting. Preferably, the copper layer is about 0.08-0.25 mu m and the gold layer no more than 0.25 mu m thick. Limiting the thickness of these layers reduces mechanical stress in the connection and these avoids cracking of the parts. |
