发明名称 |
Light emitting module having heat conductive substrate |
摘要 |
A lighting apparatus including a plurality of light-emitting elements mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer. |
申请公布号 |
US9410685(B2) |
申请公布日期 |
2016.08.09 |
申请号 |
US201414158246 |
申请日期 |
2014.01.17 |
申请人 |
Toshiba Lighting & Technology Corporation;Kabushiki Kaisha Toshiba |
发明人 |
Moriyama Takayoshi;Higuchi Kazunari;Hashimoto Sumio;Kumashiro Shinichi |
分类号 |
F21S4/00;H05K1/05;F21V29/00;F21S8/02;F21V19/00;F21V21/00;F21V29/50;F21V17/12;F21Y101/02;H05K1/02 |
主分类号 |
F21S4/00 |
代理机构 |
Banner & Witcoff, Ltd. |
代理人 |
Banner & Witcoff, Ltd. |
主权项 |
1. A module substrate comprising:
a substrate comprising a first surface, a second surface opposite to the first surface, and a corresponding portion of the second surface having a heat conductive layer; a light-emitting element mounted on the first surface; and at least two heat-conductive holes, each heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is not electrically connected to the light-emitting element, wherein the heat conductive layer is thermally connected to the material covering an inner surface of one of the at least two heat-conductive holes and the material covering an inner surface of another one of the at least two heat-conductive holes. |
地址 |
Yokosuka-shi JP |