发明名称 Light emitting module having heat conductive substrate
摘要 A lighting apparatus including a plurality of light-emitting elements mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer.
申请公布号 US9410685(B2) 申请公布日期 2016.08.09
申请号 US201414158246 申请日期 2014.01.17
申请人 Toshiba Lighting & Technology Corporation;Kabushiki Kaisha Toshiba 发明人 Moriyama Takayoshi;Higuchi Kazunari;Hashimoto Sumio;Kumashiro Shinichi
分类号 F21S4/00;H05K1/05;F21V29/00;F21S8/02;F21V19/00;F21V21/00;F21V29/50;F21V17/12;F21Y101/02;H05K1/02 主分类号 F21S4/00
代理机构 Banner & Witcoff, Ltd. 代理人 Banner & Witcoff, Ltd.
主权项 1. A module substrate comprising: a substrate comprising a first surface, a second surface opposite to the first surface, and a corresponding portion of the second surface having a heat conductive layer; a light-emitting element mounted on the first surface; and at least two heat-conductive holes, each heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is not electrically connected to the light-emitting element, wherein the heat conductive layer is thermally connected to the material covering an inner surface of one of the at least two heat-conductive holes and the material covering an inner surface of another one of the at least two heat-conductive holes.
地址 Yokosuka-shi JP