| 摘要 |
<p>PURPOSE:To contrive a reduction in a turnaround time by a method wherein a semiconductor chip is mounted on a case, stitches on the case and bonding pads or the semiconductor chip are connected with each other by bonding wires and the semiconductor chips in this state are ready-manufactured in advance. CONSTITUTION:A wafer of a constitution, wherein cells, which are respectively formed using a group of semiconductor elements necessary for constituting a basic logical circuit as one unit, are arranged on individual chips 4 on the wafer in an array form and bonding pads 42 are formed on the outer peripheries of the individual chips 4, is prepared. Such the wafer is pelletized and each pelletized semiconductor chip 4 is mounted on a case 8. Then, the respective pads 42 are connected with respective stitches on the case 8 by bonding wires 9. The semiconductor chips formed up to this state are ready-manufactured in advance as a common process, a metal film wiring pattern suited the requirements of customers is formed and a cap is made to cover on the case 8 to encapsulate the chip 4. Thereby, a reduction in a turnaround time is contrived.</p> |
