SYSTEM AND METHOD FOR CURING A RESIN DISPOSED BETWEEN A TOP AND BOTTOM SUBSTRATE WITH THERMAL MANAGEMENT
摘要
A system and method cure a combination of a top (6) and a bottom (6) substrate with a resin (8) disposed in-between. A cure platform (1500) includes a chuck on which the combination rests. A cure device (1700) cures the resin. An actuation assembly (1560) separates the chuck (1530) from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.
申请公布号
EP1030780(A1)
申请公布日期
2000.08.30
申请号
EP19980959427
申请日期
1998.11.12
申请人
FIRST LIGHT TECHNOLOGY, INC.
发明人
PARENT, SCOTT, R.;THIBAULT, THOMAS, M.;PARENT, DONALD, G.