| 摘要 |
A one chip type RF integrated module is provided to minimize installation areas on a substrate by implementing each circuit element of an RF block as a single package and arranging bonding pads in an efficient structure. A one chip type RF integrated module comprises a front end module(110), a power amplification module(130), a transceiver module(120), and a matching circuit module(140). These modules(110-140) are formed on a single substrate. The front end module(110) splits and filters multi-band Tx/Rx signals. The power amplification module(130) amplifies a Tx signal and transfers it to the front end module(110). The transceiver module(120) mutually converts and processes baseband signals and RF signals. The matching circuit module(140) matches the impedance between the transceiver module(120) and the front end module(110). The signal input/output pads of the power amplification module(130) are formed at the end area of the substrate in more than two columns.
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