| 摘要 |
PURPOSE:To detect even a part which is not soldered securely although connected electrically by utilizing heat conduction to detect a defectively soldered part. CONSTITUTION:Terminals 2a of an electric component are fixed to the copper foil pattern 1a of an electric circuit board 1 by soldering 3. A heating means 4 which heats solder 3 is provided on the opposite side of the substrate 1 from the component 2. A temperature measuring means 5 which measures the surface temperature of the terminal parts to be soldered without contacting is provided on the fitting surface side of the substrate 1 for the component 2. The output of the means 5 is connected to a decision means 6. Then when heat rays are irradiated from the reverse surface of the substrate 1 by the means 4, the solder 3 is heated through the pattern 1a of the substrate 1. The means decides whether the soldering is normal or not from the heat conduction state of the solder a certain time after the start of said heating. Thus, even a part which is electrically connected but not securely soldered can be detected.
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