发明名称 Integrated passive and active seismic surveying using multiple arrays
摘要 Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
申请公布号 US9448313(B2) 申请公布日期 2016.09.20
申请号 US201313759990 申请日期 2013.02.05
申请人 ION Geophysical Corporation 发明人 Hofland Gregg S.;Leveille Jacques P.;Kahn Daniel S.;Faber Kees;Laroo Rick;Lawson Jerry L.;Balla William A.;Saur Michael J.
分类号 G01V1/06;G01V1/28;G01V1/30;G01V1/42;G01V1/40 主分类号 G01V1/06
代理机构 Blank Rome LLP 代理人 Blank Rome LLP
主权项 1. A seismic surveying method of a subsurface volume, the method comprising: arranging arrays of sensors coupled to the subsurface volume on tubulars disposed in boreholes in a surface of the subsurface volume; collecting seismic data with the sensors; detecting a first moveout in a first of the arrays by analyzing the collected seismic data in at least one direction for the first array; detecting one or more second moveouts in one or more second of the arrays by analyzing the collected seismic data in the at least one direction for the one or more second arrays; determining that the one or more second moveouts is comparable to the first moveout; and declaring an occurrence of an event in the subsurface volume in response to the determination that the first and second moveouts are comparable.
地址 Houston TX US