| 发明名称 |
Method of drilling a hole for printed wiring board. |
| 摘要 |
<p>A method of drilling a through-hole for inter-surface conduction in a laminate for a printed wiring board, the laminate comprising a metal foil attached to an insulating material, with a water-soluble lubricant sheet on one surface or on front and reverse sides of the laminate, the method comprising drilling the through-holes in the presence of a water-soluble lubricant sheet which is 0.02 to 3 mm thick and is formed from a mixture of 20 to 90 % by weight of a polyether ester with 10 to 80 % by weight of a water-soluble lubricant.</p> |
| 申请公布号 |
EP0629109(A1) |
申请公布日期 |
1994.12.14 |
| 申请号 |
EP19940303982 |
申请日期 |
1994.06.03 |
| 申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
EJIRI, MITSUO, C/O MITSUBISHI GAS CHEM. CO., INC.;KINBARA, HIDENORI, C/O MITSUBISHI GAS CHEM. CO., |
| 分类号 |
B23B35/00;B23B41/00;B23Q11/10;B26F1/16;H05K3/00;H05K3/46;(IPC1-7):H05K3/00 |
主分类号 |
B23B35/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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