| 摘要 |
<p>PROBLEM TO BE SOLVED: To make an Al film difficult to peel at a marginal area of a wafer to suppress formation of unwanted broken pieces and improve the production yield in the assembling step of semiconductor chips, by preventing a protective film from being formed on scribe lines. SOLUTION: When integrated circuits 3 are formed after processing various steps, an Al film to form interconnections in the circuits 3 remains on marginal areas of wafers 1. After forming the integrated circuit 3, an insulation material such as silicon nitride or polyimide is laminated to form a protective film 12. To expose pads of the circuit 3 by etching, scribe line parts 20 are also etched to expose the surface of the wafer 1. As a result, the Al film 11 on the wafer 1 is exposed at the scribe lines 20 between the integrated circuit 3 and a marginal area 4. Thus, a part of the Al film 11 is never peeled with the protective film 12 at scribing, and hence the conductive broken pieces will be little produced.</p> |
